The system’s modularity gives designers the opportunity to create a fully custom backplane solution with optional power modules, guidance. 0A: 250V: EXTreme OrthoPowerНа страницах каталога оборудования вы найдете Connectors: board-to-board различных производителей - большой выбор оборудования и техники. These connectors are two-piece devices that connect two printed circuit boards. 08mm. Features a simple design, normal or reverse mounting, push-push insert style and a locking technology therefore preventing the card from falling out. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede HD2 connector family consists of modular configurations with custom power and guidance modules. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. This specification covers the performance, test, and quality requirements for the XCede HD backplane interconnect system. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. Vertical or Right Angle. XCede ® HD2 §Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test & Measurement Mechanical and Metal Parts Tools;. XCede® connectors also. 6. XCede High Speed / Modular Connectors are available at Mouser Electronics. Mechanical longevity and ruggedness. 5. Login or REGISTER Hello, {0}. XCede HD PLUS & XCede HD2 press-fit connector platform is designed with partial modular reparability. XCede PRODUCT FAMILY DAUGHTERCARD MODULE REMOVAL AND REPLACEMENT . performance (up to 28+ Gb/s) in a Hard Metric form factor. Mouser offers inventory, pricing, & datasheets for Amphenol XCede HD Series High Speed / Modular Connectors. Vertical backplane header configurations provide two, four or six differential signal pairs per column wafer with four, six or eight wafers per signal connector module. 2. 6. XCede® connectors also address. FEATURES. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. SERIES Maximum signal pins Terminal pin orientation Connector Length Type Termination Row REMARKS; HM2A30: 6 Spl: Vertical: 50. Additionally, there will be an electro-static. Advanced Search. 1. XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. Revision “F” Specification Revision Status . Customer Measurement Report: FCI XCede® Connector. 99. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. ExaMAX ® enables up to 56 Gbps performance and allows designers the option to optimize density or minimize board layer count. Price request; Print; Specifications. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 1. Mouser offers inventory, pricing, & datasheets for XCede Connectors. 8 mm, Receptacle, Press Fit. . XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCede® Backplane Connector MATERIAL §§Housing: Liquid Crystal Polymer §§Contact Base Metal: Copper Alloy §§Plating: Performance-based plating at separable interface; meets requirements of product specification ELECTRICAL PERFORMANCE §§Signal Current Rating: 1A per contact §§Ground Current Rating: 2A per contact Build your mated connector set using Samtec’s High-Speed Board-to-Board Solutionator®. Sloan 2-09-09 “A” S1979 Updated procedure, and addition of RAM and Stacker M. Offering a linear density of up to 84 differential pairs per inch (33. 1. Accepts 1. The XCede HD2 connector family consists of modular configurations with custom power and guidance. 80mm Right-Angle Backplane Receptacle; HDTF-6-08-S-RA-LC-100; HDTF - Samtec XCede® HD 1. Amphenol Communications Solutions XCede high-performance backplane connector system. The vertical header range also includes. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Wang 6/19/19. See Appendix "A" for the seating press recommendations and process recommendations. A Loyalty Bonus Cash of $1,500 (applied after taxes) is offered on all new 2022 Ram 1500 Classic models and applies to current and original owners of a Chrysler, Dodge, Jeep,. 1. DETAILS. Skip to content. 3-, 4- and 6-pair designs. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede® connectors also address. 7mil Drill Minimum Pad Size vs. Mouser offers inventory, pricing, & datasheets for Amphenol XCede High Speed / Modular Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. (1) Notes1: XCede HD RAM and XCede HD Inverted RAM use the same tool of XCede HD Daughter. 1. B S4329 Added XCede HD PLUS backplane information B. 80mm Right-Angle Backplane Receptacle (HDTF) From: £2. Connectors with six differential pairs per column fit 36 mm minimum card slot pitch and provide 82. Up to 82 differential pairs. The XCede product family encompasses XCede, XCede Plus, and X2 product lines, and their corresponding product derivatives including; daughtercard, backplane, mezzanine, right-angle-male (RAM), orthogonal,. Brand of Product：Amphenol ICC,Part#：946-200X-13X,Product Category：EXTENDED RAM MODULE,Data Type：Outline Dimension Drawing. 7. Farnell Ireland offers fast quotes, same day dispatch, fast delivery, wide inventory, datasheets & technical support. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Data rates capable up to 28 Gb/s to support system upgrades without costly redesigns. 1 XCede HD 2 Pair Backplane Customer Use Drawings C-923-201C-500 2 Pair, 6 Column Differential Backplane Module, Thick Wall C-923-201E-500 2 Pair, 8 Column Differential Backplane Module, Thick Wall 高速背板系统. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® connectors also address. The connectors are intermatable, electrically and mechanically interchangeable. High-density backplane system – up to 84 differential pairs per linear inch. Login or REGISTER Hello, {0}. In this category | In this category, (Amphenol) Memory card connector / PCI CCM01 MK5 Series. Your session is about to timeout due to inactivity. EspañolDownload XCede® Right Angle Receptacle 4-pair 8 column. Guidance and keying options. Receptacle connectors and pin connectors are through hole devices with eye-of-the-needle compliant pin contacts. XCede HD, XCede HD PLUS & XCede HD2 press fit backplane connector family onto a printed circuit board (PCB). • FCI Product Specfication GS-12-588 (XCede® Connector System) • FCI Repair Manuals (TBD) 4. Two press-fit sizes, (standard and small) provide board layout options for designers. 32. 1. Features. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. 2. Amphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. 00 mm contact wipe on signal pins. 下载3D模块 配置并加入到购物车 配置免费样品 技术参数. The Molex EXTreme LPHPower Connector is a mixed, high current power and signal connector system that picks up where traditional connectors leave off. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Buy 10113949-L0E-20DLF - Amphenol Communications Solutions - Connector, FCI XCede Series, 32 Contacts, Header, Press Fit, 8 Rows. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. Subscribe news. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 0 REFERENCEDOCUMENTS 2. 2. Login or REGISTER Hello, {0}. This type of cable is suitable for high-density networks and can reach a much longer distance than DAC and AOC. We offer interconnection systems from 2. 99 $ 19. 0217" Drill XCede HD & XCede HD PLUS press fit backplane connector family onto a printed circuit board (PCB). Buy Amphenol JX41051436 in Avnet APAC. The XCede product family encompasses XCede®, XCede Plus®, and X2 product lines, and their corresponding product derivatives including; Daughtercard, backplane, mezzanine, right- angle-male (RAM), orthogonal, right-angle-male direct-attach orthogonal (RAM DA ortho), and cable backplane 1. 3 - 8 CARBURTON STREET, LONDON, W1W 5AJ. Connectors; High Speed Board-to-Board; Micro Pitch Board-to-Board; Rugged / Power; Edge Card; Backplane / Micro Backplane; Standard Board-to-Board; Industry Standards;. Amphenol solves system design challenges with integrated interconnect solutions for applications in the networking, communications, storage, and computer server markets. Mouser offers inventory, pricing, & datasheets for XCede Connectors. English. Power blades rated up to 60 A per power bank. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Type S (same-side) and Type O (opposite-side) contact layouts allow for mirrored contacts. XCede. Integrated power and guidance. 96 and 5. Figure 20: Example XCede® HD Midplane Connector 20 LIST OF TABLES Table 1: XCede® HD , XCede® HD Plus and XCede® HD2 15. 54 - 5. Samtec XCede High Speed / Modular Connectors are available at Mouser Electronics. Wide shield contacts feature a stiffness enhancing rib and are advanced well ahead of the signals for “drag your finger across” robustness. Lukin 10/01/13 “C” “D”. Change Location. . Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets requirements of high density architectures with 35% increase in density as compared to standard XCede®. Revision SCR No. Offering a linear density of up to 84 differential pairs per inch and can meet requirements of high density architectures. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. High-speed, high-density backplane systems include ExaMAX® and XCede® HD in a variety of pair and column counts. Choice of 2 or 4 power banks. Random Access Memory, or RAM (pronounced as ramm ), is the physical hardware inside a computer that temporarily stores data, serving as the computer's "working" memory. My main workstation is based on Ryzen 7 5800X, Asus Crosshair VIII Dark Hero, 64 GB RAM, 1TB Samsung 980 PRO SSD, EVGA RTX 3070ti FTW3 GPU, etc. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support. /PRNewswire/ -- Newark/element14, a leading multi-channel, high-service electronics distributor in the Americas, and a business of global Premier Farnell,. - FCI. Basically, it is how all major components inside a computer talk with each other. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Ruggedized design for high reliability and ease of application. 4-, 5-, 6-, 8-pair configurations. TARGET MARKETS. 信号端子上可实现高达3. 4, 6 or 8 columns. 1. 4, 6 or 8 columns. 5 out of 5 stars 3,424. Small form factor high-density backplane system ideal for density-critical applications, with a modular design and optional features for flexibility and customizable solutions. They can either add a new cabling solution with backplane components at right angles, or expand their systems horizontally. Amphenol Communications Solutions. 1. The XCede ® HD Plus backplane connector achieves high . The system’s. 4, Gen. DC Connector Configurations. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. 1. PCIe Gen. Role: Data Engineer Salary: up to €95k (DOE) + Benefits Remote Working Policy: Fully remote available Location: Mainz (fully remote) Tech Stack: Spark/Hadoop, Data Lake, AWS/Azure, Python, Kafka, Airflow, Docker, CI/CD. Login or REGISTER Hello, {0}. Formed in 2020 by a merger of three well. 7. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Copper Weight and Annular Ring (“A/R”) 7 Table 2: XCede® HD and XCede® HD Plus 17. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. These point loads may be caused by other beams, user input loads, or columns carried by the beam. TARGET MARKETS. . . 3-, 4- and 6-pair designs; 4, 6 or 8 columns; Standard or high-speed wafers available; 85 Ω and 100 Ω options; Modular design provides flexibility in applications The XCede HD interconnect platform also has available RAM (Right Angle Male). The XCede HD interconnect platform also has available RAM (Right Angle Male). TARGET MARKETS. Luxshare-TECH Gen-Z provides the full range of configuration: 1C，2C，4C，4C+，8C and HP (. backplane to expander board connector (BP_XCEDE_2) 3. Figure 14: Typical Force vs. Login or REGISTER Hello, {0}. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. The XCede HD® connector leverages the same core technologies as standard XCede®, providing a robust solution for tighter card pitches and chassis designs where space requirements and density are critical. XCede® connectors also address. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. DC Connector Configurations XCede HD connector system. The applications for these connectors include IEEE 10GBASE-KR and 25GBASE-KR, or OIF CEI-6G, CEI-11G, CEI-28G. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingThis document describes the methods and tooling for the installation of Amphenol TCS XCede HD,XCede HD PLUS&XCede HD2right angle press-fit daughtercard connectors onto a printed circuit board (PCB). 2. XCede HD achieves the highest performance in an HM compatible form factor. Buy 928-4000-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Series, Receptacle, Press Fit. challenging architectures. Amphenol is one of the leading manufacturers of Backplane connectors. Revision SCR No. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Get a Free Sample. developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). $19. Integrated power and guidance. 2. EachAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Scalable upgrades to 56Gb/s. The standard XHD2 differential interconnect platform consists of connectors featuring 3, 4, or 6 differential pairs, with an optional extra ground lead available on the A wafer. 2 - One mezzanine card per node, mirrored ; 3 - Two IO Modules per node, mirrored. The XCede daughtercard connector can be assembled using individual segments up to 8” in length (8 inches for 2, 3, and 4 pair connectors and 6 inches for 5 and 6 pair connectors), and segments may be joined after individual pressing to total over 18” in length. Contact us today for more details of XCede, part number 922-440G-F3H Toggle Nav. You previously purchased this product. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with cooling. XCede. 2 Host Interface Connector The BCM957504-N425G OCP network adapter interfaces with the system baseboard via the gold fingers compliant with the SFF-TA-1002 specification. See Figure 15 for details. These modules consist of a 12. 7. XCede® connectors also address. DETAILS. 2 617-0450-014 xcede hd 4pair stiffener 1 1 922-421f-d3h xcede hd 4pair lc mod w/ organizer, 8pos, 100ohms, bifurcated, . 27 - 12. 2. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management LCD&LED Displays Automation & Control Power & Batteries Test. AMPHENOL COMMUNICATIONS SOLUTIONS. TARGET MARKETS. Nashua, NH, February 2, 2009– Amphenol TCS, the leading provider of high performance backplane interconnect systems, today announced two additions to the XCede® connector platform – XCede 85 Ohm and XCede cables and assemblies. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede ® I/O connector supports next generation 100G+ applications and. High-speed, high-density backplane systems include ExaMAX ® and XCede ® HD in a variety of pair and column counts. Pin header. The XCede backplane connector system provides mechanical longevity and ruggedness required by today’s systems. Those components include CPUs, GPUs, SSDs, Hard Drives, Sound Cards, and Wi-Fi Cards, among others. Login or REGISTER Hello, {0}. 20mm HPTS Power Modules feature press-fit tails, vertical mounts, and come in a variety of body heights to match signal module pair count. Xcede Group is a global recruitment organisation that delivers technology and energy talent solutions which enable companies to innovate and grow. see tb-xxxx for board weight limitations. 20mm Power Modules. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Revision “F” Specification Revision Status . Sign Up or Register. XCede® Connectors - Amphenol CS | DigiKeyXCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. Amphenol Communications Solutions XCede high-performance backplane connector system. Contact Mouser (Bangalore) 080 42650011 | Feedback. Discover More. 0225" Drill Compliant Pin Protrusion (mm) (negative numbers result in no protrusion) 0. BENEFITS. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Xcede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. Click OK to extend your time for an additional 30 minutes. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today's challenging architectures. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. screw length and part number are dependent on daughtercard thickness (as specified from configurator). 2. 00 mm的触点滑动范围. DETAILS. These connectors are two-piece devices that connect two printed circuit boards. The stiffener may help straighten the board edge, but this does not necessarily preclude the need for additional board stiffening. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. Change LocationAmphenol TCS XCede® Backplane Connectors are designed to offer readily available 85Ω and 100Ω solutions while maintaining the same mating interfaces. Female pin. 7. jx410-51594 rev drawing no. Four-pair connectors provide 54. Attention! Your ePaper is waiting for publication! By publishing your document, the content will be optimally indexed by Google via AI and sorted into the right category for over 500 million ePaper readers on YUMPU. 3. 80 mm column pitch. Meets the high density needs of today's designs. 1. 4, 6 or 8 columns. § Differential pairs 28-84 per inch (11-33 differential pairs perAmphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. challenging architectures. Revision “D” Specification Revision Status . 2. XCede connectors also address requirements for higher linear signal density at the interface of backplane and daughter card. XCedeHD RAM and XCede HD Inverted RAMrefer to. a SFP+ adapter that's super-short 3. DETAILS. Find Parts Learn More. These modules consist of a 12. 40mm pitch, supporting speeds up to 32Gb/s (BergStik ®, Dubox ®, Minitek ®, BergStak ®, Conan ®, Rib-Cage ® ). Login or REGISTER Hello, {0}. 0 REFERENCE 2. English. XCede HD achieves the highest performance in an HM compatible form factor. 2. 高速、高密度背板系统包括了各种对数和列数的ExaMAX®和XCede® HD。. Additional RAM allows a computer to work with more information at the same time, which usually has a considerable effect on total system. The XCede connector delivers the lowest crosstalk of any backplane connector available today. 特色. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. Our solutions include Wire-to-Board, Board-to-Board, Input/Output and FFC/FPC. 3-, 4- and 6-pair designs. EN. 40G QSFP+ to QSFP+ AOC Cable. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede ® HD Plus connector meets the high density needs of today’s . 1. HDTM. The XCede® Right-Angle Male (XCede® RAM) connector is an intelligent device that offers two options for designers. Shear Stud Connectors. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed, serial data rate requirements demanded by next-generation equipment in data centers and service provider networks. 2. 3-, 4- and 6-pair designs. XCede® connectors also address. Description Initial Date “A” S2401 Initial Release E. Typically, XCede compliant pins will require an insertion force of 2-10 lbs/pin. signal connectors can be configured with 2, 4 or 6 differential pairs per column, providing up to 82. Column counts of 4, 6 and 8 allow for sizing the connector to the required differential pair count. Please confirm your currency selection:2. XCede Connectors are available at Mouser Electronics. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. Mouser offers inventory, pricing, & datasheets for Amphenol Xcede Series High Speed / Modular Connectors. They are available in 1. Mouser offers inventory, pricing, & datasheets for XCede High Speed / Modular Connectors. XCede® connectors also address. Typical applications include communications and data such as hubs, switches, routers, wireless infrastructure, servers, external storage systems, and more. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. XCEDE® BACKPLANE CONNECTOR SYSTEM OVERVIEW XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. 2” Long 694-4529-000 – 2-Pair RAM Loading Head 2. Buy 928-4050-A7H - Amphenol Communications Solutions - Connector, 4 Diff Pair, XCede HD Plus Series, Receptacle, Press Fit. Login or REGISTER Hello, {0}. Get a Free Sample. 2. Buy 923400E40H - Amphenol Communications Solutions - Connector, 8 Col x 4 Diff Pair, XCede HD Series, 1. XCede® connectors also address. A full range of flash memory connectors are offered by Amphenol, including SD, Mini-SD, Micro-SD, xD, CF1 & 2. 3. English Deutsch Français Español Português Italiano Român Nederlands Latina Dansk Svenska Norsk Magyar Bahasa Indonesia Türkçe Suomi Latvian Lithuanian česk. 4 differential pairs/inch, suiting architectures with multiple front or rear fabric slots and blade systems with coolingComponents. EN. 2. asm jx410-51594_bp. Integrated Circuits IGBTs MOSFETs Discrete Semiconductors RF and Microwave Passives Motors & Actuators Microphones & Speakers Connectors Electronic Materials Thermal Management. A HIGH-DENSITY, DIFFERENTIAL, LOW-COST CONNECTOR SOLUTION FOR DATA. XCede® Family Cable Assemblies § Extends the reach of passive copper for next generation real world system designs; complementary with direct orthogonal designs, intermatable with existing board mount connector designs § Lowers overall system costs by reducing or eliminating the need for expensive active devices like retimers and high TB-2253 XCede HD Family Daughtercard Wafer Removal and Replacement. Español $ USD United States. We would like to show you a description here but the site won’t allow us. DDR SDRAM - Evolution of High-Performance Volatile Memory. 54mm pitch down to 0. Amphenol Communications Solutions XCede® connector platform is designed for 25 Gb/s performance to provide the headroom to support future high-speed. XCede® HD结合了小巧的外形和优异的设计灵活性，实现了电路板和系统空间的大幅节省。系统的模块化使设计师能够借助可选电源模块、导引和锁合以及侧壁来打造出完全定制的背板解决方案，从而提高耐用性。 XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backwards mating interface compatibility with existing XCede products. HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH VIRTUAL SHIELD TECHNOLOGY AirMax VS ®. Click to download Certificate of. Features & Benefits. 5-inch backplane 1. English. 1. XCede® connectors also address. 40G QSFP+ to QSFP+ DAC Cable. Ruggedized design for high reliability and ease of application. Features. The series offers mechanical longevity and ruggedness, guidance and keying options, and. 3A per pin current rating and mount individually to the backplane. Newark offers fast quotes, same day shipping, fast delivery, wide inventory, datasheets & technical support.